TSMC最近在2022年开放创新平台生态系统论坛上宣布了开放创新平台（OIP）3DFABRIC联盟。The new TSMC 3DFabric Alliance is TSMC’s sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness — with a full spectrum of best-in-class solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging.
This alliance will help customers achieve speedy implementation of silicon and system-level innovations and enable next-generation HPC and mobile applications using TSMC’s 3DFabric technologies, a comprehensive family of 3D silicon stacking and advanced packaging technologies.
“ 3D硅堆叠和高级包装技术为芯片级别和系统级创新的新时代打开了大门，还需要广泛的生态系统合作，以帮助设计师在他们可用的无数选择和方法中浏览最佳路径。”L.C.博士Lu，TSMC研究员和设计与技术平台的副总裁。“Through the collective leadership of TSMC and our ecosystem partners, our 3DFabric Alliance offers customers an easy and flexible way to unlocking the power of 3D IC in their designs, and we can’t wait to see the innovations they can create with our 3DFabric technologies.”
“As a pioneer in both chiplets and 3D silicon stacking, AMD is excited about the introduction of TSMC’s 3DFabric Alliance and the vital role it will play in accelerating system-level innovation,” added AMD senior vice president of technology & product engineering Mark Fuselier. “We’ve already seen the benefits of working with TSMC and its OIP partners on the world’s first TSMC-SoIC™-based CPUs, and we’re looking forward to collaborating even more closely to drive the development of a robust chiplet stacking ecosystem for future generations of energy-efficient, high-performance chips.”
Partners of the new 3DFabric Alliance have early access to TSMC’s 3DFabric technologies, enabling them to develop and optimize their solutions in parallel with TSMC. This gives customers a head start on their product development with early availability of the highest-quality, readily-available solutions and services from EDA and IP to DCA/VCA, Memory, OSAT(半导体组件和测试），基板和测试。
“亚马逊Annapurna Labs团队负责为Amazon Web Services客户在硅建立创新，并且随着我们使用TSMC的高级包装技术开发AWS Trainium产品，我们一直在与TSMC合作，包括Cowos（包括Cowos）和its support infrastructure from architecture definition, package design, and process validation, to successful production,” said Nafea Bshara, Amazon Web Services, VP and distinguished engineer. “As a TSMC customer, we are pleased by the introduction of TSMC’s OIP 3DFabric Alliance, which demonstrates TSMC’s leadership and commitment to next-generation 3D IC design enablement.”
New collaboration with 3DFabric Alliance Partners
- EDApartners have early access to the TSMC 3DFabric technologies for EDA tool development and enhancement to offer optimized EDA tools and design flows to enable 3D IC designs more efficiently.
- IPpartners develop 3D IC IPs compliant with die-to-die interface standards and TSMC 3DFabric technologies to provide a broad variety of highest-quality, proven IP solutions for customers.
- DCA/VCApartners gain early collaboration with mutual customers in 3DFabric technologies and roadmap alignment with TSMC that will improve their service capability for 3DFabric design, IP integration, and production.
- Memory合作伙伴具有早期的技术参与度，可以定义规格和与TSMC的工程和技术标准的早期对齐，这将缩短未来HBM世代的市场时间，以满足3D IC设计要求。
- 基质partners have early technology engagement and development with TSMC to meet future requirements of 3DFabric technologies that will improve substrate material quality, reliability, and new substrate integration to speed up production of customers’ 3D IC designs.
- 测试合作伙伴与TSMC进行了早期合作，以开发TSMC 3DFabric Technologies的测试和压力方法，从而全面覆盖可靠性和质量要求，以帮助客户快速推出其差异化产品。
“NVIDIA has been manufacturing with TSMC’s CoWoS technologies and supporting infrastructure for several generations of high-performance GPU products,” said Joe Greco,senior VP, advanced technology group, NVIDIA. “TSMC’s new 3DFabric Alliance will extend the technology to a broader set of products and an enhanced level of integration.”
为了解决3D IC设计的上升复杂性，TSMC引入了TSMC 3DBLOX标准，以使用合格的EDA工具和TSMC 3DFABRIC技术的合格EDA工具和流量统一设计生态系统。模块化的TSMC 3DBlox标准旨在以一种格式建模3D IC设计中的关键物理堆叠和逻辑连接信息。
TSMC曾与EDA合作伙伴在3DFabric Alliance中合作，以启用3D IC设计的各个方面的3DBlox，包括物理实施，定时验证，物理验证，电子迁移IR Drop（EMIR）分析，热分析等。TSMC 3DBlox旨在最大程度地提高灵活性和易用性，并提供最终的3D IC设计生产力。
TSMC 3DFabric technologies
TSMC 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies, further extends the Company’s advanced semiconductor technology offerings to unleash system-level innovations.TSMC’s 3DFabric consists of both frontend, 3D chip stacking or TSMC-SoIC (System on Integrated Chips), and backend technologies that include the CoWoS and InFO family of packaging technologies, enabling better performance, power, form factor, and functionality to realize system-level integrations.
In addition to CoWoS and InFO that have been in volume production, TSMC also started TSMC-SoIC silicon stacking manufacturing in 2022. TSMC now has the world’s first fully automated fab for 3DFabric in Chunan, Taiwan that integrates advanced testing, TSMC-SoIC, and InFO operations together, offering the best flexibility for customers to optimize their packaging by leveraging better cycle time and quality control.