Infineon Technologies AG, in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies, is introducing the IRS2975C imager sensor — a performance-push evolution of the IRS2875C.
该成像仪根据飞行时间(TOF)原理的工作,称为间接TOF(I-TOF),并且是基于Infineon的Pixel技术最新进步的行业中的第一个。IRS2975C的外形和性能都是根据不断增长的ITOF应用程序量身定制的,以最佳的功率预算提供了最高的运行范围。
新的I-TOF成像仪非常适合智能手机,服务机器人,无人机以及各种物联网设备的消费者用例。
Infineon’s latest pixel technology includes advanced 3D field engineering enabling the best demodulation efficiency. Additionally, a buried optical reflector elevates quantum efficiency (QE) to a level so far only reached by back-side illumination (BSI) sensors, while maintaining the cost advantage of front-side illumination (FSI) sensors.
Combined with the IRS9102C VCSEL driver, the IRS2975C reduces the bill of materials for camera modules and provides differentiating features for the high-volume smartphone segment.
IRS2975C具有半四分之一的视频图形阵列(HQVGA)分辨率为240 x 180像素,市场定义芯片尺寸为18毫米2对于1/6英寸的图像圆。它提供具有SBI的高敏性10 µm像素,并启用具有低功率运行的高度集成系统。
成像仪我s designed to support 2.8 volt supply rails. Furthermore, the device provides full laser safety functionality such as a unique eye protection mechanisms and offers high flexibility in customizing use cases and output power.
Filed Under:Components,News,Sensors
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