Infineon Technologies AG, in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies, is introducing the IRS2975C imager sensor — a performance-push evolution of the IRS2875C. The imager works according to the Time-of-Flight (ToF) principle known as indirect ToF (i-ToF) and is the first in the industry based on Infineon’s latest advancements in pixel technology.…

Diodes Incorporated, in response to rapidly growing opportunities in pre-installed in-vehicle USB charging, has announced a highly integrated dual-channel USB Type-C protocol decoder. The DIODES AP43776Q supports USB power delivery (PD) 3.1 standard power range (SPR), programmable power supply (PPS), and Quick Charge QC5 fast-charging protocols. It also supports legacy battery charging (BC) 1.2 and…

STMicroelectronics‘ latest X-CUBE-TCPP software pack enhances the company’s portfolio of USB Type-C port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification. USB Power Delivery supports operating modes from legacy 5V/0.5A up to 48V/5A (240-Watt) in the latest Revision 3.1 specification. The expanded power capacity inspires innovative product design…

Infineon Technologies AG has been named a CES 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK), and Smart Alarm System (SAS) for smart homes. This year’s program received a record-high number of over 2,100 submissions. The announcement was made ahead of CES 2023, the world’s most influential technology event,…

STMicroelectronics is simplifying designers’ search for high-performing operational amplifiers (op amps) by introducing three new 6MHz rail-to-rail devices with strong all-around parameters including a wide operating voltage range and low noise. The TSB511, TSB512, and TSB514 are single, dual, and quad op amps, respectively. They can operate from a single supply in the range from 2.7V to 36V, and…

Texas Instruments (TI) announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions. TI developed a new device screening specification called space high-grade in plastic (SHP) for radiation-hardened products and introduced new analog-to-digital converters (ADCs) that meet the SHP qualification. TI also introduced…

Renesas Electronics Corporation是高级半导体解决方案的供应商，它引入了Versaclock 7时钟生成器，这是一个可配置的可配置时钟生成器家族，具有内部晶体振荡器，用于PCIE和网络应用程序，用于高端计算，有线基础架构和数据中心设备。Versaclock 7提供了无与伦比的灵活性，使设计人员能够配置频率，输入/输出（I/O）级别，…

STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has revealed a wireless power receiver with the industry’s highest available power rating of 100 Watts. Ensuring the fastest wireless charging times in the market today, ST’s new STWLC99 device can recharge high-end smartphones with the largest battery capacity in less than 30…

Developers of industrial automation systems are looking to shift away from the reliance on proprietary solutions for process synchronization to standard-based solutions that offer broader compatibility and reduce design costs. To deliver critical process synchronization, Microchip Technology has announced the LAN8840 and LAN8841 Gigabit Ethernet transceiver devices that meet IEEE 1588v2 standards for Precision Timing…

Nexperia是基本半导体的专家，宣布扩大其用于工业和汽车应用程序的夹键合式平面力（CFP）包装二极管的投资组合。最新的添加剂包括四个650 V，1 A零件CFP3和CFP5软件包，旨在用于车载充电器（OBC）和电动汽车的逆变器，电动转换器，PV…

Samsung Electronics announced that Bixby, and its artificial intelligence (AI) voice assistant, supports Latin American Spanish as a language option. Latin American Spanish-speaking Bixby users around the world now have the option to interact with their Samsung Galaxy devices in their local language — as Brazilian Portuguese was previously the only Latin American language supported…

由联合国欧洲经济委员会（UNECE）引入的，新的R155法规旨在解决对互联汽车的网络安全的越来越多的关注。该法规于2022年7月生效，要求车辆制造商对其产品和流程采用安全性方法。为了在市场覆盖的市场中实现新车销售

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is entering the automotive radar market with the introduction of a 4×4-channel, 76-81GHz transceiver designed to meet the demanding requirements of ADAS (advanced driver assistance systems) and Level 3 and higher autonomous driving applications. Leveraging automotive expertise accumulated through years of global customer engagements, Renesas will…

When designing portable and battery-powered audio devices for consumer speaker applications, maximizing battery playback time and maintaining excellent audio performance in a compact form and at a low-system cost is essential. MERUS multilevel switching technology from Infineon Technologies is designed to achieve low switching losses and highly efficient amplification at both low and high output…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its low-power WAN product line as part of its strategy to deliver connectivity devices used for smart cities, smart homes, medical devices, and industrial applications. The new RYZ024A supports Cat-M1 and NB-IoT (Narrowband Internet of Things) internet connectivity without the need for a gateway…

高级半导体解决方案的供应商Renesas Electronics Corporation宣布，其数百个辐射硬化（RAD-HARD）集成电路（ICS）（包括50个不同零件数字）在11月16日爆炸的Artemis 1发射。Intersil-Brand Rad-Hard IC是电池管理系统，RS-25发动机控制电子设备和发射中止…的一部分…

At electronica 2022, Infineon Technologies launched the XMC7000 microcontroller (MCU) family for advanced industrial applications, including industrial drives, electrical vehicle (EV) charging, two-wheel electrical vehicles, and robotics. The XMC7000 series offers single and dual-core options of 350-MHz 32-bit Arm Cortex-M7 and a 100-MHz 32-bit Arm Cortex-M0+, up to 8 MB of embedded flash and 1…

Enabling smarter connections to the world around us, Texas Instruments (TI) has introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline the adoption of the Matter protocol in the Internet of Things (IoT) applications. The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in…

STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has revealed that its ST54K IC is handling control and security for contactless NFC communication in the newly launched Google Pixel 7 smartphone. Chosen by Google’s designers, ST’s device combines NFC control and a certified Secure Element in a single chip that saves…

三星电子,提供先进的内存technology, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry’s highest bit density. At 1Tb, the new V-NAND also features the highest storage capacity to date, enabling larger storage space in next-generation enterprise server systems worldwide.…