在英飞凌科技公司(Infineon Technologies AG)股价与3 d T的合作ime-of-Flight specialist and premium partner pmdtechnologies, is introducing the IRS2975C imager sensor — a performance-push evolution of the IRS2875C. The imager works according to the Time-of-Flight (ToF) principle known as indirect ToF (i-ToF) and is the first in the industry based on Infineon’s latest advancements in pixel technology.…

Diodes Incorporated, in response to rapidly growing opportunities in pre-installed in-vehicle USB charging, has announced a highly integrated dual-channel USB Type-C protocol decoder. The DIODES AP43776Q supports USB power delivery (PD) 3.1 standard power range (SPR), programmable power supply (PPS), and Quick Charge QC5 fast-charging protocols. It also supports legacy battery charging (BC) 1.2 and…

STMicroelectronics‘ latest X-CUBE-TCPP software pack enhances the company’s portfolio of USB Type-C port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification. USB Power Delivery supports operating modes from legacy 5V/0.5A up to 48V/5A (240-Watt) in the latest Revision 3.1 specification. The expanded power capacity inspires innovative product design…

Infineon Technologies AG has been named a CES 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK), and Smart Alarm System (SAS) for smart homes. This year’s program received a record-high number of over 2,100 submissions. The announcement was made ahead of CES 2023, the world’s most influential technology event,…

STMicroelectronics is simplifying designers’ search for high-performing operational amplifiers (op amps) by introducing three new 6MHz rail-to-rail devices with strong all-around parameters including a wide operating voltage range and low noise. The TSB511, TSB512, and TSB514 are single, dual, and quad op amps, respectively. They can operate from a single supply in the range from 2.7V to 36V, and…

Texas Instruments (TI) announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions. TI developed a new device screening specification called space high-grade in plastic (SHP) for radiation-hardened products and introduced new analog-to-digital converters (ADCs) that meet the SHP qualification. TI also introduced…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced the VersaClock 7 clock generators, a family of configurable clock generators with an internal crystal oscillator for PCIe and networking applications in high-end computing, wired infrastructure, and data center equipment. The VersaClock 7 delivers unmatched flexibility, enabling designers to configure frequencies, Input/Output (I/O) levels,…

STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has revealed a wireless power receiver with the industry’s highest available power rating of 100 Watts. Ensuring the fastest wireless charging times in the market today, ST’s new STWLC99 device can recharge high-end smartphones with the largest battery capacity in less than 30…

Developers of industrial automation systems are looking to shift away from the reliance on proprietary solutions for process synchronization to standard-based solutions that offer broader compatibility and reduce design costs. To deliver critical process synchronization, Microchip Technology has announced the LAN8840 and LAN8841 Gigabit Ethernet transceiver devices that meet IEEE 1588v2 standards for Precision Timing…

Nexperia, an expert in essential semiconductors, has announced the expansion of its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include four 650 V, 1 A parts available in CFP3 and CFP5 packages intended for use in onboard chargers (OBC) and inverters for electric vehicles, power converters, PV…

Samsung Electronics announced that Bixby, and its artificial intelligence (AI) voice assistant, supports Latin American Spanish as a language option. Latin American Spanish-speaking Bixby users around the world now have the option to interact with their Samsung Galaxy devices in their local language — as Brazilian Portuguese was previously the only Latin American language supported…

Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing focus on cybersecurity in connected automobiles. This regulation, which came into effect in July 2022, requires vehicle manufacturers to apply a security-by-design approach to their products and processes. To enable new vehicle sales in markets covered by…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is entering the automotive radar market with the introduction of a 4×4-channel, 76-81GHz transceiver designed to meet the demanding requirements of ADAS (advanced driver assistance systems) and Level 3 and higher autonomous driving applications. Leveraging automotive expertise accumulated through years of global customer engagements, Renesas will…

When designing portable and battery-powered audio devices for consumer speaker applications, maximizing battery playback time and maintaining excellent audio performance in a compact form and at a low-system cost is essential. MERUS multilevel switching technology from Infineon Technologies is designed to achieve low switching losses and highly efficient amplification at both low and high output…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its low-power WAN product line as part of its strategy to deliver connectivity devices used for smart cities, smart homes, medical devices, and industrial applications. The new RYZ024A supports Cat-M1 and NB-IoT (Narrowband Internet of Things) internet connectivity without the need for a gateway…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off on November 16th. Intersil-brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort…

At electronica 2022, Infineon Technologies launched the XMC7000 microcontroller (MCU) family for advanced industrial applications, including industrial drives, electrical vehicle (EV) charging, two-wheel electrical vehicles, and robotics. The XMC7000 series offers single and dual-core options of 350-MHz 32-bit Arm Cortex-M7 and a 100-MHz 32-bit Arm Cortex-M0+, up to 8 MB of embedded flash and 1…

TSMC recently announced the Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric Alliance is TSMC’s sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness — with a full…

Enabling smarter connections to the world around us, Texas Instruments (TI) has introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline the adoption of the Matter protocol in the Internet of Things (IoT) applications. The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in…

STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has revealed that its ST54K IC is handling control and security for contactless NFC communication in the newly launched Google Pixel 7 smartphone. Chosen by Google’s designers, ST’s device combines NFC control and a certified Secure Element in a single chip that saves…